Quick look at: RV-129 RV Diamond Scriber

Precision diamond scriber for manual scribing with 8"-Ø, vacuum, chuck, fine adjustable in X-and Ø- digital gauge for X resolution 10µm, cross hair microscope lined up with the scribe trace to use it as a reference for further scribes. max. scribe length 220 mm, max. X travel 190 mm.

This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substrates. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous. All essential operating parameters - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results.

For fast and easy scribing of ceramics, glass, silicon, GaAs, InP and many more

Facts RV-129

Technical information and figures

Technical Data RV-129

Max. Cutting length/width:  

200mm / 100mm

Dimensions: 

500 x 500 x 300mm

Weight: 

appox. 25kg

Features RV-129

Rotating vacuum Chuck for maximum 1 x 200mm wafer

4 Notches for 90° snap into position

Mounted on X/Y stage with linear bearings

Adjustable mounting positions to vary scribing angle

Angle adjustment via micrometer

• Resolution: 0,006°
• Resolution: 4°

Micro meter adjustment for scribing height and X positioning to match the Y line

X-Axis max. Range ≤ 240mm, resolution 10 μm with digital gauge

Y-Axis max. Range ≤ 240mm scribing length

Substrate thickness ≤ 10mm

Adjustable touch-down/lift up diamond tool Y position setting scribing length

Diamond tool with 4 cutting edges

Scribing pressure: 5  581gr. (positioning weights on balance scale)

Monocular microscope with reticle (100 increments)

• 40X
• Resolution of scale reticle: ½ increments ≤ 8 μm
• LED Illumination

Common Applications RV-129

Ceramics

Glass

Silicon

GaAs

InP

Options RV-129

Additional values

Vacuum pump for substrate/wafer clamping and Z-Axis diamond tool movement

Vacuum chuck for wafers fragments down to 5 x 5mm

Digital Camera