Quick look at: SRO-714/SRO-716
IR VACUUM REFLOW SYSTEM
With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and SRO-716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements.
The Solder Reflow Ovens SRO-714 and SRO-716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid.
Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result the SRO-714 and SRO-716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or SRO-716 our 100-Step-Recipe will make programming easy and guarantee superb process results.
Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and SRO-716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.
Facts SRO-714/SRO-716
Technical information and figures
Technical Data SRO-714/SRO-716
Footprint:
960 x 720 x 1340mm (LxWxH)
Weight:
240kg. (options dependent)
Chamber Height:
up-to 100mm
Heated Area:
SRO-714 230 x 217mm
SRO-716 314 x 314mm
Chamber Lid Open/Closing:
Manual
Heating Method:
SRO-714 IR (8pcs. Lamp Array)
SRO-716 IR (12pcs. Lamp Array)
Heating Zones:
SRO-714 2
SRO-716 3
Power connection:
3Ph.-N-PE 230/400V 50/60Hz
Power:
SRO-714 6,5kW
SRO-716 17kW
Common Applications SRO-714/SRO-716
IGBT/DBC
Power Semiconductors
Sensors/IR Bolometer Detector
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing
MMICs
Transient liquid phase soldering/bonding
Ag sintering
Thermo compression bonding
CPV, Laser bar
Features SRO-714/SRO-716
Flux-less, Solder Paste and Flux
Direct IR Heating
Surface touch TC
Multiple TC monitoring
Exchangeable Ceramic Heater Plate
Process temperature 450°C up to 750°C
Temperature ramp-up rate 3,5K/s
Temperature cool-down rate 2K/s
Rapid single wafer processing < 20K/s
Oxygen = N2 supply quality
HELIUM leak rate 5 x 10¯9 mbar l/s
100 steps/programm
Options SRO-714/SRO-716
Additional values
Spring pin array (in chamber lid)
Custom tailored substrate fixture
Flux management
Flux and solder paste
300 kPa
Top heater:
– Up to 1000°C
– Rapid single wafer processing < 50°C/sec.
Lift pins
Formic acid enriched atmosphere
Diaphragm/Scroll/turbo pump < 5 x 10¯6 mbar
H2 and N2H2 safety feature
Gas plasma atmosphere
H2O / O2 analyzing
RGA/Mass spectrometer
Integration into glove box
Process development