Quick look at: SRO-700

TABLE TOP – IR VACUUM REFLOW SYSTEM

Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic process requirements.

And this table top soldering system is the ideal tool for R&D applications as well. With its rapid thermal annealing and brazing capabilities, the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. Whether using flux, flux less or solder paste the SRO-700 is an incredibly versatile reflow oven for every thinkable semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.

Just imagine creating a flux less process via a formic acid atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption the SRO-700 is prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.

Facts SRO-700

ATV SRO-700

Footprint:  770 x 560 x 800mm (LxWxH)

Weight: 65 kg (options depending)

Chamber Height: 100mm

Heated Area:  230 x 217mm (9” x 8.5”)

Chamber Lid Open/Closing:  Manual

IR Heating:    Array of 8 IR lamps in Quartz glass tubes (2 Heating zones)

Power connection:  3Ph-N-PE 230/400V, 50/60Hz

Power: 6,5 kW to 6.5 kW
Temperature ramp-up rate 3,5K/sec.(to 3.5K/sec.)
Oxygen < 1,0ppm with PURIFIED N2(to 1.0ppm)

Common Applications SRO-700

• IGBT/DBC
• Power Semiconductors
• Sensors
• MEMS Devices
• DIE Attachment
• High Power LED
• Hybrid Assembly
• Flip Chip
• Package Sealing

Features SRO-700

• Flux-less, with Flux and solder paste
• FORMIC ACID ENRICHED ATMOSPHERE
• Direct IR Heating
• Multiple TC monitoring
• Process temperature 450°C up to 700°C
• Temperature ramp-up rate 3,5K/sec.
• Temperature cool-down rate 2K/sec.
• Rapid single wafer processing < 20°C/sec.
• Oxygen < 1,0ppm with PURIFIED N2
• 100 steps/RECIPE program

Options SRO-700

• Additional values
• Spring Pin Array (in chamber lid)
• Custom tailored substrate fixture
• Graphite heater plate
• Spring clamps on hot plate
• Lid Lock
• KF40/CF63 port on chamber lid
• Diaphragm/Scroll/turbo pump < 5 x 10¯⁵ mbar
• Closed loop water chiller/heater