In the Microelectronics world, solder reflow has come to describe the process of melting a metal or metal alloys to adhere two, or more, structures within or on a device. Soldering is generally done at temperatures <500℃ and brazing > 500℃.
Some of the critical machine parameters for good solder reflow are the control of temperature, temperature ramp rate, cooling, cooling ramp rate and full atmospheric control.
Control of or breaking/removal of oxides is also critical to achieving good adhesion. This particularly an issue with some or the lead-free low temperature alloys. This can be achieved with the use of reducing atmospheres such as Formic Acid, Forming gas, Hydrogen or flux.
TABLETOP – IR VACUUM REFLOW SYSTEM
Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 tabletop IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic process requirements.
And this tabletop soldering system is the ideal tool for R&D applications as well. With its rapid thermal annealing and brazing capabilities, the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.
With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. Whether using flux, flux less or solder paste the SRO-700 is an incredibly versatile reflow oven for every thinkable semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.
Just imagine creating a flux less process via a formic acid atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption the SRO-700 is prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.
IR VACUUM REFLOW SYSTEM
With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and SRO-716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for any and all of your process requirements.
The Solder Reflow Ovens SRO-714 and SRO-716 offer the perfect tool for reflow soldering applications, rapid thermal annealing and brazing capabilities. Moreover, the direct IR lamp heating technology will provide you with a maximum heated surface of 314 mm². With its outstanding process stability and repeatability this tool is found in almost every major R&D center and pilot line production. In order to achieve void free and prefect solder joints ATV applies all of its know-how in cold wall technology, IR heating, vacuum assembly and formic acid.
Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area of both the SRO-714 (217x230mm) and the SRO-716 (314x314mm) offers excellent flexibility. As a result, the SRO-714 and SRO-716 can be utilized in every conceivable semiconductor and MEMS application – whether using flux, fluxless or solder paste for your reflow process. When working with the SRO-714 or SRO-716 our 100-Step-Recipe will make programming easy and guarantee superb process results.
Just imagine creating a fluxless process via a formic acid enriched atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption both the SRO-714 and SRO-716 are prepared for the latest generation of flux-based solder pastes which depend on low oxygen content during the process run.
PROGRAMMABLE OVEN WITH INFLATABLE MEMBRANE FOR THERMO COMPRESSION BONDING APPLICATION
ATV’s successful SRO-71X series IR vacuum reflow oven is the heart of ATV’s reflow soldering principle. Our SRO-71X-TCB, Thermal Compression Bonding is also based on which this system is developed. The Single Cold Wall Process Chamber approach is a standard on itself and is also applied for the SRO-71X-TCB which fulfills all your process requirements.
Our Thermal Compression Bonding system has an isostatic press in combination with an elastomer membrane. This patented technology gives you the opportunity to use a maximum pressing force of 0,5MPa over 150 mm Ø. This pressure can be gradually built up to the desired process pressure under which you want to perform your process. With our applied membrane technology, you will not be faced with product shifting from start to finish. Another advantage for our technology is that you may process simultaneously products which have a different topography. This will have no influence on the expected final process results.
Also, in this tool ATV uses all its know-how of the cold wall technology in combination with the IR heating concept, vacuum assembly as well as formic acid atmosphere to achieve the prefect solder joints you need for a reliable product. Working with the SRO-71X-TCB you will notice that programming is easy and with the 100 step programming steps you will be able to fine tune your process in such a way that a process success is guaranteed.
It is ATV’s goal to always reach the market best soldering results using its proven single Chamber Process concept as its core competence for over 30 years.