NT Series vacuum chambers for plasma etching and cleaning for various industries worldwide
Unique Specifications
- Ability to perform in direct, R.I.E. and downstream plasma modes without tooling change overs
- Stainless steel chamber for high process cleanliness and system integrity
- State of the art process controller geared for process development
- Proprietary add ons & options
- Available in stand alone or table top
Features
- Stainless steel design provides chamber cleanliness only surpassed by quartz chambers
- All inert contruction eliminates possibility of contamination from the tool itself (no plastics or teflon)
- Each tool can be configured to operate in one or more of the standard plasma modes without modification (downstream, direct, or RIE mode)
- Achieves unsurpassed uniformity in both shelf to shelf device to device calculations
- Uniformity of our reactors allows us to maximize the number of working shelves in each tool
- High end no value reduced controller and high quality transducers monitor every important parameter for the process, providing a full diagnostic feedback
- Compatible with carriers for wafers, leadframes and substrates, connectors, etc.
- Available in 3 sizes to meet your throughput and power density needs
Applications
- 300mm wafer etching for reclaim
- BGA, Lead frames, C.O.B., Hybrids
- Plasma cleaning in all sectors of semiconductor packaging
- Enhancement of die attach, wire bonding and molding
- Optics
- PCB
- Flat panel etching and cleaning
- Solar Cell applications
- Wafer processing
- Wafer probe manufacture
The FA 2000 Reactive Ion Etch system specializing in the decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semi-Conductor industry
Unique Specifications
- Quad input manifold provides uniform conductance of process gases and high etch uniformity on wafers
- Operation within a wide pressure band enables fast isotropic etching at higher temperatures and exceptionally clean anisotropic etching at lower temperatures
- Operation within a temperature range from 0 - 125°C enhances etch rates and selectivity
- I.C.P , endpoint detection and other advanced options
Failure Analysis for Semiconductors
- Passivation removal - Isotropic polyimide removal, anisotropic or isotropic silicon nitride removal
- Removal of interlayer dielectrics - packages and 150 mm or 200 mm wafers accommodated
- Unsurpassed tabletop performance in single wafer cleaning, stripping, etching or reverse sputtering
Decapsulation
- Industry leader and I.P. forerunner
- First and only qualified system to interface with patented laser decapsulation technology
- Etch rates for many compounds more than 1 mil per hour
- Fastest removal of epoxy and plastic molding materials
- Uses unique Fillerblast® technology
Other Applications
- Research and development
- Manufacture of wafer probe cards
- Patterning and trenching in various materials
- Material sciences