BSET EQ has partnered with the best companies to offer the best process equipment available. We are proud to offer our own line of plasma clean/etch and RIE systems. We are also the exclusive North American distributor for ATV Technologie, GmbH. As a full-service distributor, we sell and service the complete line of ATV process equipment.
Solder Reflow
In the Microelectronics world, solder reflow has come to describe the process of melting a metal or metal alloys to adhere to two, or more, structures within or on a device. Soldering is generally done at temperatures <500℃ and brazing > 500℃.
Some of the critical machine parameters for good solder reflow are the control of temperature, temperature ramp rate, cooling, cooling ramp rate, and full atmospheric control.
Control of or breaking/removal of oxides is also critical to achieving good adhesion. This particularly an issue with some or the lead-free low-temperature alloys. This can be achieved with the use of reducing atmospheres such as Formic Acid, Forming gas, Hydrogen or flux.
Possible equipment solutions:
Automated High Volume Reflow
There are many times when simple manual processing of Microelectronic devices. The obvious reason would be increased production throughput. Least obvious reasons could be the reducing of process “touch time” or better process control.
Automated reflow process has been a challenge for traditional batch type reflow equipment. ATV has overcome this by the introduction of the i-Line systems. This system has full automation of loading and unloading with configurations of up to three (3) process chambers. This can all be incorporated into an existing or new automated production line.
Possible equipment selection: SRO-iLine
MEMS getter activation and high vacuum lid seal
MEMS (microelectromechanical systems) are microelectronic devices with small movable structures used in everything from projectors to gas sensors and gyroscopes. Over the past few years, these types of device have infiltrated all nature of electronic devices. Think about the simple act of the screen on your smartphone changing orientation when you move, this was accomplished with a MEMS sensor.
The nature of the internal structure, within the devices, require very sophisticated assembly technics for the device to operate properly. Many times, these devices need to be packaged in a high vacuum environment and the activation of getter materials to maintain vacuum levels.
Possible equipment solution: SRO-706
Sintering
Sintering is a process where material \are pressed together to form a solid mass without reach a liquid form. In microelectronics, this can be useful when a material (metal) needs to be used but the temperature limitations of the device exclude the use of standard reflow or brazing processes.
Reactive ION Etching (RIE).
RIE is the process of removing previously deposited material from wafers or boards using chemically reactive plasma. The plasma produces high energy ions that attack the wafer surface and react with the deposited material.
Applications
- Research and Development
- Failure Analysis
- Package Level Failure Analysis
- Passivation Removal
- Anisotropic Silicon Nitride Removal
- Functional De-layering
Possible equipment solutions:
FA-2000
FA-3000
Plasma: Clean, Etch, Treat
Plasma technology utilized in manufacturing has a history dating back forty years. The applications for gas plasma technology continue to grow at an exponential rate. There are several reasons for this...
- Worldwide reduction of CFC’s and other chemicals typically used for cleaning/etching in wet processes.
- Wide use of composite materials in manufacturing resulting in new challenges with bonding and adhesion.
- After initial investment plasma processes are more efficient and cost-effective.
- Plasma provides a safer and cleaner surroundings for operators and is environmentally friendly.
- In some manufacturing environments, plasma provides the only solution.
The NT series is a proven design and is our most versatile product line. High tech, flexibility, and affordability have always been important assets at BSET. Whether you are doing R&D or full-scale production runs there is an NT system designed for your application.
No company in plasma can beat our design, quality or experience. BSET EQ offers laboratory services to help qualify its technologies for your applications. We are proud to extend these valuable services before and after ownership of our quality equipment and services.
Possible equipment solutions:
NT Series
SP Series
Wafer processing with multipurpose fast ramping furnace
Since 1982 ATV is manufacturing the multipurpose fast ramping furnaces PEOs series with a single quartz tube. It was initially developed for thick film paste firing. Since a large variety of new and different processes and applications was and is still being added. ATV applies its PEO series successfully also in the semiconductor market segment.
The PEO series is an ideal tool for R&D purposes, pilot line, and mass production. It can be applied easily for new unique and sophisticated process development as well as low to medium volume production applications. This multipurpose furnace has several key aspects integrated and can handle wafers up to 200mm.
Next to floor space-saving advantages the PEO also has Zero energy usage in ambient stand-by. Another unique aspect of the system is the multi-process capability when using our easy exchangeable Liners. To reach the optimal temperature uniformity ATV uses 14 Kanthal heating elements that are positioned around, at the front and on the backside the process tube and are PID controlled.
There are many possible processes that may need to be completed on wafers. Some of the potential process steps could be:
- Annealing
- Polymid Cure
Some deposition processes may be:
- Thermal Oxidation
- Low-Temperature Oxidation
- TEOS Oxides
- Poly and α – Silicon
- Epitaxy
Possible equipment solutions:
PEO Series
SRO-714
SRO-716
Wafer Scribing
ATV Diamond Scribers perform fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substrates. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous. All essential operating parameters - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results.
Possible equipment solutions:
RV 126/127
RV 129