Failure analysis (FA) is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability.
Many manufacturers of high reliability (Hi-Rel) devices, ICs and PCBs have resident FA labs to quickly analyze device failures and to determine the root cause of the failure. These labs usually employ destructive Physical Analysis (DPA) to determine failure cause. This allows the engineering staff to determine the best solution to eliminate the fault in their manufacturing process. When you are manufacturing high value, mission-critical devices failures are not an option.
When a device has been protected by an Epoxy Molded Compound (EMC) the challenges to good FA are substantial. The challenge is to remove the EMC without damaging the structures and components imbedded within the EMC. The process of removing EMC for FA is called Decapsulation (decap).
The traditional method of decap uses a combination of sulfuric and nitric acids to remove EMC. This process can work well if the test subjects are made of Au wires, nitride passivation, and metallic substrates. However, if the device contains Cu, Ag components and/or wires, or the die must remain functional, the acid will cause even more damage.
The goal is to be able to inspect and test underlying components and structures to determine the root failure cause, not cause false failures. Decapsulation can be the answer to this problem.
BSET EQ offers, state of the art, systems to help achieve the very best FA processes possible. These systems are in two (2) categories, pre-cavitation, and decapsulation.
Laser Ablation (pre-cavitation)
This process is used to quickly remove EMC, to just above the top of the wires to prepare the device for decap.
The baublys BL2500 is a tabletop laser tool for laser decapsulation and ablation. This compact system offers large system features such as Z-axis with a lift capacity of 300mm and is fully CNC controlled. The system is powered by IPG fiber laser technology and is equipped with a high-resolution Ethernet camera with 5Mp.
The baublys BL5500 is a standalone laser tool for laser decapsulation and ablation. This system offers the latest technology and features such as Z-axis with a lift capacity of 300mm and is fully CNC controlled. The system is powered by IPG fiber laser technology and is equipped with a high-resolution Ethernet camera with 5Mp. The system also includes software that allows for automatic position change and a color vision system
This process is used to remove EMC, down to the second wire bond without significant damage to the wires, structures or die. This process can be used and leave the die fully functional.
The BSET EQ Plaser™ is the world's first, and best, automated plasma decapper. The system has many advanced features that make it the system of choice for your plasma decapsulation need. The system offers unparalleled control and speed which allows for the removal of EMC in as little as 1 hour all while maintaining the integrity of the components.
Combination of laser ablation and plasma decapsulation in one unit:
Plaser™ / Laser Decapsulation system.
We have combined the power of laser ablation and the accuracy of plasma decap into a single unit. This system allows for the use of both processes in a single, space-saving footprint.