- Decapsulation involves the removal of the EMC (Epoxy Mold Compound) without destroying Cu related underlying parts of the microelectronic circuit.
- The EMC structure consists of an amine or anhydride cured epoxy which surrounds quartz or glass fillers that typically are spherical in shape.
- Some EMC is impervious to Acids due to high filler content combined with hard cures. (Power devices) Note that wire loops are exposed to the removal media ( Acids for example) much longer than the die due to their location within the chip itself in the EMC removal process.
- Decapsulation can be accomplished using Laser Ablation down to within approximately 100 micon of the die.
